Semiconductor Raw Material Processing:
Ingot Rounding/Coring, Wafer Resizing, Gallium Nitride Wafer, Wafer Profiling, Gallium Oxide Crystal, Diamond Seed
Ingot Rounding/Coring:
Complete edge material.
No chipping risk.
Multi-functional machine for coring, edge cutting, notching, and profiling.
Processable thickness: 0.05-25mm.
Section roughness: approximately 1μm
Our product center maintains a steadfast focus on innovation and has secured hundreds of technological patents.
9AM - 5:30PM
Our Office Hours: Mon. - Fri.
TEL:+86 18723607109
EMAIL:Server@sovix.cn
ADD:ChongQing China
