Water-guided Laser -- Packaging and Heat Sink Material Processing in the Semiconductor Industry

Category：4.4 Laser Supporting Equipment
Factory Number(FN):：196#

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Packaging and Heat Sink Material Processing:
Copper-based diamond, diamond heat sink, aluminum-based diamond, diamond two-dimensional heat sink, other metals and alloys, microchannel processing

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Water-guided Laser -- Packaging and Heat Sink Material Processing in the Semiconductor Industry

Category：4.4 Laser Supporting Equipment

Factory Number(FN):：196#

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Our product center maintains a steadfast focus on innovation and has secured hundreds of technological patents.

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