1. No Focus Adjustment Required for Thick Materials: Processing depth up to 60mm without needing to adjust the focus during operation.

2. Deep Cuts Without Taper: The cylindrical structure of the waterjet ensures parallel laser transmission, resulting in perpendicular laser-cut surfaces without taper.

3. No Edge Chipping on Hard, Brittle Materials: Continuous microjet cooling significantly reduces chipping in brittle materials.

4. Minimal heat-affected zone and slag buildup: Continuous microjet cooling and flushing of the cutting area effectively removes debris. Processed samples exhibit virtually no heat-affected zone, thermal deformation, or thermal stress, with negligible surface slag accumulation.

5. Uniform energy distribution within the microjet cross-section prevents uneven material ablation caused by laser spot energy imbalance, thereby reducing surface roughness and minimizing chipping.

Features:

1. Processes hard, brittle materials without chipping edges: diamond, silicon carbide, silicon nitride, polycrystalline boron nitride.

2. Processes ultra-thin materials without chipping or deformation—water force as low as 1 Newton.

3. Achieves groove aspect ratios up to 30:1,

enabling high aspect ratio narrow slots and high depth-to-diameter ratio micro-holes.

4. Low cutting loss when machining expensive materials, with slot widths as narrow as 0.05mm.