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Water-guided Laser Equipment -- Ceramic Components
Category:4.4 Laser Supporting Equipment
Factory Number(FN)::196#
Description

1. Silicon carbide components;

2. Silicon carbide crucible;

3. Silicon carbide drilled section;

4. Silicon carbide gear;

5. Silicon carbide gear;

6. Silicon carbide rings (round and square);

7. Silicon carbide grid. Square grid with 1.1×1.1 mm sides, edge margin (wall thickness) 0.15 mm. Overall uniformity with minimal slag inclusions and chipping.

8. Silicon carbide array inclined holes;

9. Zirconia bearings;

10. Zirconia gears;

11. Zirconia gears;

12. Zirconia rotors;

13. Zirconia probe components;

14. Boron carbide core sampling;

15. Boron carbide ball drill for blind holes;

16. Tungsten carbide core drilling;

17. TGG core drilling;

18. Piezoelectric ceramic components;

19. Cutting circular rings and square rings from piezoelectric ceramic blocks.

20. Cutting and drilling aluminum oxide/aluminum nitride ceramic substrates;

21. Cutting and granulating 3D ceramic substrates and dam-type ceramic substrates.

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Water-guided Laser Equipment -- Ceramic Components
Category:4.4 Laser Supporting Equipment
Factory Number(FN)::196#
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