Semiconductor Equipment Precision Ceramic Parts Processing:

Solve the problems that traditional processing methods cannot process precision ceramic right-angle, special-shaped, and ultra-thin parts such as silicon carbide, silicon nitride, boron carbide, and zirconia.
Solve the pain points of low efficiency and low yield in traditional processing of precision ceramic parts.
The maximum processable thickness reaches 50mm
The minimum processable aperture is 0.3mm