This machine is designed and developed for high-viscosity dispensing of solder paste, widely used in PCB boards, FPC, chip packaging and other applications. Its software, hardware and dispensing technology are all industry-leading.
Advantages
· High-precision glue control with single-liquid screw valve
· Automatic positioning with glue path detection function
· Automatic needle alignment and automatic glue wiping
· Glue bubble detection and pressure monitoring
· Product color recognition and glue color recognition
· Laser height measurement and automatic weighing
· Press-fit control and MES system connection